SMT machine presents five major trends to select equipment should be fully assessed

        Relevant experts pointed out that up to 50% of the defects that occurred in the manufacturing process that require rework originated in the mounting process, so the development of the patch equipment was most noticeable. As the main component of the electrical interconnection technology and the surface assembly technology of the main technology, SMT, is the mainstream of modern electrical interconnection technology. After more than 20 years of development, SMT has become the main technical means of PCB-level component-level interconnection of modern electronic products.Relevant data shows that the penetration rate of SMT application in developed countries has exceeded 75%, and further development of assembly technology represented by technologies such as high-density assembly and stereo assembly. The continuous development of assembly technology will certainly put forward new requirements for the development of assembly processes and related equipment. How to shorten the running time, speed up the conversion time, and continuously introduce the components with a large number of pins and fine pitch have become the severe challenges faced by today's placement equipment. Choosing the right placement equipment to meet the needs of today's applications is a difficult decision, but it is a very important choice, because the dependence of production capacity and versatility of electronic product assembly on placement equipment quite big.

         One direction of development: High-efficiency dual-channel transport structure The new SMT machine is moving toward a high-efficiency dual-feed conveyor structure in order to increase production efficiency and reduce working time more quickly. Based on the performance of the traditional single-channel placement machine, the dual-channel transporter mounts the PCB's transportation, positioning, detection, and patching into a two-way structure. The working mode of this dual-circuit placement machine can be divided into synchronous mode and asynchronous mode. In the synchronous mode, two PCBs of the same size are sent from the dual track to the mounting area for simultaneous placement. In asynchronous mode, the PCBs of different sizes are sent to the mounting area. Both of these work methods can shorten the invalid working time of the mounter and improve the production efficiency of the machine.

         Two directions of development: The placement speed, accuracy, and placement capabilities of high-speed, high-precision, multi-functional, and intelligent placement machines have always been in conflict with each other. The new placement machine has been working hard toward high-speed, high-precision, and multi-purpose development. . Due to the continuous development of surface mount components (SMC/SMD), its package form is constantly changing. New packaging such as BGA, FC, CSP, and so on, the requirements for mounting machines are getting higher and higher. In the United States and France, the mounter adopts the “flight detection” technique to increase the mounting speed. The patch head is operated after the suction is detected to improve the mounting speed of the mounter.Siemens, Germany, introduced intelligent control on its new placement machine, allowing the placement machine to have the lowest error rate while maintaining a high productivity. On the machine, there are FC Vision modules and Flux Dispenser to meet the mounting requirements of FC. . Yamaha Corporation of Japan introduced a dual-group rotary patch head in the newly introduced YV88X model, which not only improved the mounting speed of integrated circuits, but also ensured better placement accuracy.

         The development direction 3: Multi-cantilever, multi-mount heads In the traditional arch-arrival mounter, only one cantilever and mount head are included. This can no longer meet the demand for speed in modern production. For this reason, people are in a single cantilever patch. Based on the machine, a double cantilever mounter was developed, such as Universal Instruments' GSM2 and Siemens' S25. The two patch heads were alternately attached to the same PCB, and the production was doubled when the machine floor space did not change much. effectiveness. In order to further increase production efficiency, people have also introduced four cantilever machines based on double cantilever machines, such as HS60 from Siemens, GC120 from Universal Instruments, CM602 from Panasonic, and GHX-1 from Hitachi, all of which are currently mainstream high-speed stickers on the market. Tablet models. Multi-cantilever machines have replaced the status of turrets and become the mainstream trend for the development of high-speed placement machines in the future.

        Development Direction 4: Flexible Connection, Modularity The new SMT machine has been developed towards flexible placement systems and modular structures in order to enhance adaptability and efficiency of use. Fuji Corporation of Japan changed the traditional concept and divided the mounter into a control host and a function module machine. According to the different needs of users, the flexible combination of the control host and the function module machine can meet the needs of users. The module machine has different functions. According to the mounting requirements of different components, it can be mounted with different accuracy and speed to achieve high efficiency. When the user has new requirements, it can add new functions as needed. Modular machine. Because it is possible to flexibly add different types of placement units according to future needs to meet future flexible production requirements, this kind of module-structured machine is very popular with customers. When the product changes, it is very timely to improve the workability of the equipment. Important, because new packages and circuit boards bring new requirements. Investment in a placement device should often be based on current considerations and estimates of future needs.Buying more equipment than is currently required can often avoid business opportunities that may be missed in the future. It is economically more economical to upgrade on existing equipment than to purchase a new one. Another development direction of modularity is the functional module components, which are embodied in the following: the host of the mounter is made into standard equipment, and a unified standard stand platform and a universal user interface are equipped; various kinds of dispensing patches The function is made into a functional module component, and the user can install the required functional module component or replace the new component on the host as needed to realize the new functional requirements required by the user. For example, the placement machine of Universal Instruments Inc. of the United States only needs to exchange the dispensing assembly and the patch assembly when the functions from the dispensing to the patch are interchanged. This equipment is suitable for multi-tasking, multi-user, and short production cycle processing companies.

         Development Direction 5: Automated Programming Capabilities For very special components, new vision software tools should have the ability to “learn” automatically. Users do not have to manually input parameters into the system and create device descriptions from scratch. They only need to take the device to the visual The camcorder can be seen in front of the camera, and the system will automatically generate a comprehensive description similar to CAD. This technology can improve the accuracy of device descriptions, reduce the errors of many operators, and speed up the creation of component libraries, especially in the case of frequent introduction of new devices or use of uniquely shaped devices, thereby increasing production efficiency. The development of the placement machine is always the most concerned area in the electronic manufacturing industry. At present, the development of electronic technology has constantly put forward new and higher requirements for placement equipment, and in turn, the new development of electronic component placement equipment is effectively Promote the development of electronic assembly industry, and then promote the development of electronic technology. At present, as the placement equipment market continues to mature, the difference from one platform to another platform is getting smaller and smaller. Because of this, the content of the buyers of placement equipment should be beyond the description, and the evaluation of the equipment is comprehensive, not only the hardware but also the software, and consider the following key factors: machine type, imaging and flexibility. With these insights, you can identify the pros and cons of different devices and make wise choices.